US Patent Issued to SeeQC on May 27 for "System and method for superconducting multi-chip module" (American, Philippine Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,757, issued on May 27, was assigned to SeeQC Inc. (Elmsford, N.Y.).

"System and method for superconducting multi-chip module" was invented by Daniel Yohannes (Stamford, Conn.), Denis Amparo (White Plains, Philippines), Oleksandr Chernyashevskyy (White Plains, N.Y.), Oleg Mukhanov (Putnam Valley, N.Y.), Mario Renzullo (Yonkers, N.Y.), Andrei Talalaeskii (Mahopac, N.Y.), Igor Vernik (Yorktown Heights, N.Y.), John Vivalda (Poughkeepsie, N.Y.) and Jason Walter (Trumbull, Conn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for bonding two superconducting integrated circuits ("chips"), such that the bonds electrically interconnect the chips. A p...