US Patent Issued to SEAGATE TECHNOLOGY on Oct. 21 for "Laser heat sinking for integrating laser diode into recording heads at wafer level" (Irish, British Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,666, issued on Oct. 21, was assigned to SEAGATE TECHNOLOGY LLC (Fremont, Calif.).

"Laser heat sinking for integrating laser diode into recording heads at wafer level" was invented by Fadi El Hallak (Londonderry, Great Britain), Bryn John Howells (Londonderry, Great Britain), Michael Gerald Boyle (Derry, Ireland), Frank Anthony McGinnity (Derry, Ireland) and Martin Liam McGarry (Ballymena, Ireland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method comprising the steps of forming a recording head comprising a waveguide, a heat sink and a bleed resistor on a first substrate, is described. The bleed resistor is coupled to the heat sink and the subs...