US Patent Issued to Seagate Technology on Aug. 19 for "Joining components from wafers having different pattern densities" (Irish, British Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,433, issued on Aug. 19, was assigned to Seagate Technology LLC (Fremont, Calif.).

"Joining components from wafers having different pattern densities" was invented by Paula Frances McElhinney (Londonderry, Great Britain), Brendan Lafferty (Donegal, Ireland) and Marcus Benedict Mooney (Donegal, Ireland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A first set of components (e.g., recording head components) is formed on a first wafer at a first pattern density. A second set of components is formed on a second wafer at a second pattern density that is less than half that of the first pattern density. The first and second sets of components are joined t...