US Patent Issued to Seagate Technology on April 29 for "Adhesive for processing a microelectronic substrate, and related methods" (Illinois, Minnesota, Wisconsin Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,575, issued on April 29, was assigned to Seagate Technology LLC (Fremont, Calif.).

"Adhesive for processing a microelectronic substrate, and related methods" was invented by Zubair Ahmed Khan (Villa Park, Ill.), Dat Quach (Savage, Minn.), Andrew Habermas (Bloomington, Minn.) and Joel William Hoehn (Hudson, Wis.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of...