US Patent Issued to SCREEN Holdings on Sept. 9 for "Method of controlling the patterned wafer process temperature using the contact type thermometer in the front side of a dummy substrate to accurately measure emissivity in order to perform temperature measurement using radiation thermometer" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,761, issued on Sept. 9, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).

"Method of controlling the patterned wafer process temperature using the contact type thermometer in the front side of a dummy substrate to accurately measure emissivity in order to perform temperature measurement using radiation thermometer" was invented by Shuhei Onishi (Kyoto, Japan) and Takahiro Kitazawa (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "While a wafer having a front surface to which a thermocouple is attached is heated, a temperature of the front surface of the wafer is measured with the thermocouple and a temperature of a back surface th...