ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,906, issued on Sept. 16, was assigned to SCREEN HOLDINGS Co. LTD. (Japan).
"Substrate processing method and substrate processing apparatus" was invented by Takaaki Ishizu (Kyoto, Japan) and Yuta Nakano (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes a step of supplying a dry processing liquid onto the upper surface of the substrate, to thereby form a liquid film of the dry processing liquid on the upper surface of the substrate (Step S14), a step of heating the substrate from the side of a lower surface thereof in a state where the liquid film of the dry processing liquid is formed on the upper su...