ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,066, issued on Oct. 14, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).
"Substrate processing method" was invented by Teppei Nakano (Ismaning, Germany), Takayoshi Tanaka (Kyoto, Japan), Shota Iwahata (Ismaning, Germany) and Hiroyuki Yashiki (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes an oxidation step of heating a plurality of substrates inside an oxidation space while supplying an oxygen gas or an ozone gas to the plurality of substrates to change surface layers of molybdenum films to molybdenum trioxide, a first transfer step of transferring the plurality of substrates inside the oxi...