ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,010, issued on Nov. 4, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).
"Substrate processing method and substrate processing apparatus" was invented by Linh da Ho (Kyoto, Japan), Masaki Inaba (Kyoto, Japan) and Kei Suzuki (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method for removing an organic film on a substrate includes a) carrying out introduction of ozone-containing gas into a substrate processing chamber to fill at least a space above the substrate in the substrate processing chamber with ozone-containing gas, b) starting spraying through the space a heated chemical liquid containing sulfuric ac...