ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,061, issued on March 18, was assigned to SCREEN HOLDINGS Co. LTD. (Japan).

"Substrate processing method" was invented by Tetsuya Emoto (Kyoto, Japan), Shigeru Yamamoto (Kyoto, Japan), Daiki Fujii (Kyoto, Japan), Kenji Edamitsu (Kyoto, Japan), Keiji Iwata (Kyoto, Japan), Yuya Kawai (Kyoto, Japan) and Kenichi Ito (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method is provided. The substrate processing method includes: (S7) supplying a water repellent agent (SMT) to a substrate (W); (S11) supplying dilute isopropyl alcohol (dIPA) to the substrate (W) after the supplying a water repellent agent (SMT), the dilute i...