ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,366, issued on June 17, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).
"Substrate processing apparatus and substrate processing method" was invented by Sei Negoro (Kyoto, Japan) and Masayuki Orisaka (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a spin chuck that holds a substrate, and a fluid nozzle disposed to face a principal surface of the substrate which is held by the spin chuck. The fluid nozzle includes a gas discharge port from which a gas is discharged radially from the center side of the principal surface of the substrate to the peripheral edge side, and a gas flow passage ...