US Patent Issued to SCREEN Holdings on Jan. 13 for "Substrate treatment method and substrate treatment device" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,463, issued on Jan. 13, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).

"Substrate treatment method and substrate treatment device" was invented by Takayoshi Tanaka (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method processes a substrate. The substrate has a major surface including a concave-portion forming surface that forms a concave portion. A to-be-removed layer is formed in the concave portion. The substrate processing method includes an etching step of supplying an etching liquid that contains etching ions to the major surface of the substrate to etch the to-be-removed layer, a concentrating ste...