US Patent Issued to SCREEN Holdings on Aug. 26 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,868, issued on Aug. 26, was assigned to SCREEN Holdings Co. Ltd. (Japan).

"Substrate processing method and substrate processing apparatus" was invented by Takashi Akiyama (Kyoto, Japan), Tomohiro Takahashi (Kyoto, Japan) and Mitsutoshi Sasaki (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method is a method of performing an etching process on a substrate with an etching solution in a processing tank. The substrate includes silicon oxide films and silicon nitride films stacked alternately. The etching solution contains phosphoric acid. The substrate processing method includes immersing the substrate in the etching...