ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,490, issued on Jan. 13, was assigned to SCREEN Holding Co. Ltd. (Kyoto, Japan).

"Heat treatment apparatus and heat treatment method" was invented by Tomohiro Ueno (Kyoto, Japan) and Hiroshi Miyake (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat treatment apparatus is a heat treatment apparatus managing a dummy wafer. The heat treatment apparatus includes: a heat treatment part performing a heat treatment on the dummy wafer; a damage detection part detecting a damage of the dummy wafer; and a controller determining whether or not the dummy wafer can be used based on damage information detected by the damage detection part."

The p...