ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,226,822, issued on Feb. 18, was assigned to SCHLUMBERGER TECHNOLOGY Corp. (Sugar Land, Texas).
"Additive manufacturing process of 3D electronic substrate" was invented by Steven O. Dunford (Missouri City, Texas) and Mark Kostinovsky (Houston).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming electronic substrates and assemblies is provided. The method includes forming a first layer, including co-depositing a first material and a second material, where the first material and the second material are co-deposited as powders, binders, slurries, inks, or combinations thereof, and at least partially sintering or curing the first layer of co-de...