ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,491,572, issued on Dec. 9, was assigned to SCHAEFFLER TECHNOLOGIES AG & Co. KG (Herzogenaurach, Germany).
"Heating device" was invented by Cedric Benaben (Toulouse, France) and Stephane Vitali (Toulouse, France).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heating device suitable for heating at least one soldered joint between an electronic component including at least a first contact mound and a printed circuit board. The soldered joint on the one hand securing the electronic component to the printed circuit board and on the other hand, while providing electrical continuity, the electronic component also having an electronic-component width, and an e...