US Patent Issued to santec Holdings on Nov. 11 for "Measurement method and measurement apparatus for measuring thickness of semiconductor wafer" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,741, issued on Nov. 11, was assigned to santec Holdings Corp. (Aichi, Japan).

"Measurement method and measurement apparatus for measuring thickness of semiconductor wafer" was invented by Hiroyuki Itoh (Aichi, Japan), Atsushi Morosawa (Aichi, Japan) and Keiji Isamoto (Aichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A measurement apparatus for measuring a thickness of a semiconductor wafer includes: an optical system configured to perpendicularly irradiate a sample wafer and a reference wafer with light, and receive interference signals of the light reflected on front and back surfaces of the respective wafers; a signal processor configur...