US Patent Issued to SANECHIPS TECHNOLOGY on Dec. 9 for "Interposer with signal transmission vias and chip package structure" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,420, issued on Dec. 9, was assigned to SANECHIPS TECHNOLOGY Co. LTD. (Shenzhen, China).

"Interposer with signal transmission vias and chip package structure" was invented by Leqi Li (Shenzhen, China), Yelei Xie (Shenzhen, China), Jian Pang (Shenzhen, China) and Tuobei Sun (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are an interposer and a chip package structure. The interposer may include: at least one signal transmission vias; at least one insulator isolation rings, one of said insulator isolation rings encircling one of said signal transmission vias; and at least one reverse-biased PN junction isolation rings, one of s...