US Patent Issued to SANECHIPS TECHNOLOGY on Aug. 12 for "Method and apparatus for measuring electromigration of solder joint" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,986, issued on Aug. 12, was assigned to SANECHIPS TECHNOLOGY Co. LTD. (Guangdong, China).

"Method and apparatus for measuring electromigration of solder joint" was invented by Niuyi Sun (Guangdong, China), Dan Yang (Guangdong, China), Na Mei (Guangdong, China) and Tuobei Sun (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a method and an apparatus for measuring electromigration of solder joints. The method includes: determining, according to voltage test pads led out from both ends of one or more solder joints, a voltage of a daisy subchain between the one or more solder joints (S502); and determining, according to the...