US Patent Issued to Sandisk Technologies on Sept. 30 for "Multiple circuit board assembly including a support element and method of manufacture thereof" (Indian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,855, issued on Sept. 30, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Multiple circuit board assembly including a support element and method of manufacture thereof" was invented by Arjun Jayaprakash Guzar (Bangalore, India), Joe Paul Moolanmoozha (Bangalore, India) and Shailesh R. Nayak (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods are described for assembling multiple circuit boards using support elements to provide a stacked circuit board assembly. A support element is mounted to a first (e.g., main) circuit board, and a pair of additional circuit boards (e.g., daughter boards) are mounted ...