US Patent Issued to Sandisk Technologies on Sept. 23 for "Bonded assembly containing conductive via structures extending through word lines in a staircase region and methods for making the same" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,602, issued on Sept. 23, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Bonded assembly containing conductive via structures extending through word lines in a staircase region and methods for making the same" was invented by Masanori Tsutsumi (Yokkaichi, Japan), Hiroyuki Ogawa (Yokkaichi, Japan) and Mitsuteru Mushiga (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded assembly includes a first memory die and a logic die. The first memory die includes a first alternating stack of first insulating layers and first electrically conductive layers, first memory opening fill structures, a first stepped dielectric mat...