US Patent Issued to Sandisk Technologies on Oct. 28 for "Three-dimensional memory device with backside support pillar structures and methods of forming the same" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,749, issued on Oct. 28, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Three-dimensional memory device with backside support pillar structures and methods of forming the same" was invented by Akihiro Tobioka (Nagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional memory device includes alternating stacks of insulating layers and electrically conductive layers. The alternating stacks are laterally spaced apart among one another by backside isolation assemblies. At least one of the backside isolation assemblies generally extends along a first horizontal direction with lateral undulations along a second horizon...