US Patent Issued to Sandisk Technologies on Oct. 28 for "Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,699, issued on Oct. 28, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same" was invented by Shingo Totani (Yokkaichi, Japan), Fumitaka Amano (Yokkaichi, Japan) and Kensuke Ishikawa (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Bonding strength and yield can be enhanced by providing a mating pair of a convex bonding surface and a concave bonding surface. The convex bonding surface can be provided by employing a conductive barrier layer having a higher electrochemical potential than copper. The c...