US Patent Issued to Sandisk Technologies on Oct. 21 for "Bonded assembly including interconnect-level bonding pads and methods of forming the same" (Japanese, American Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,451, issued on Oct. 21, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Bonded assembly including interconnect-level bonding pads and methods of forming the same" was invented by Kensuke Ishikawa (Yokkaichi, Japan), Shingo Totani (Yokkaichi, Japan), Fumitaka Amano (Yokkaichi, Japan) and Rahul Sharangpani (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded assembly includes a first semiconductor die that includes first metallic bonding structures embedded within a first bonding-level dielectric layer, and a second semiconductor die that includes second metallic bonding structures embedded within a second bonding-le...