US Patent Issued to Sandisk Technologies on Nov. 4 for "Semiconductor device with reduced stress die pick and place" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,097, issued on Nov. 4, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Semiconductor device with reduced stress die pick and place" was invented by Xin Tian (Shanghai), Junrong Yan (Shanghai), Chee Keong Chin (Shanghai), Weili Wang (Shanghai) and Yang Lei (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor dies formed on a wafer may be picked from the wafer with little or no stress, thus preventing cracking and damage to the semiconductor dies. A die attach film (DAF) layer is laminated onto an inactive surface of the wafer and the DAF layer is cut in the outline of the dies. The inactive surface of the wafer may the...