US Patent Issued to Sandisk Technologies on Nov. 25 for "Three-dimensional memory device including composite backside metal fill structures and methods for forming the same" (Japanese, American Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,751, issued on Nov. 25, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Three-dimensional memory device including composite backside metal fill structures and methods for forming the same" was invented by Rahul Sharangpani (Fremont, Calif.), Raghuveer S. Makala (Campbell, Calif.), Ryo Kambayashi (Yokkaichi, Japan) and Fumitaka Amano (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate; memory stack structures vertically extending through the alternating stack; and a backside trenc...