US Patent Issued to SANDISK TECHNOLOGIES on Nov. 25 for "Semiconductor device package having improved conductive stub coverage" (Chinese, Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,761, issued on Nov. 25, was assigned to SANDISK TECHNOLOGIES INC. (Milpitas, Calif.).

"Semiconductor device package having improved conductive stub coverage" was invented by Simon Dong (Shanghai), Hope Chiu (Shanghai), Weiting Jiang (Shanghai), Elley Zhang (Shanghai), Kent Yang (Hsinchu, Taiwan), Hua Tan (Shanghai), Jerry Tang (Shanghai) and Rui Guo (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a multi-layer substrate including a bottom layer and a top layer. One or more dies are mounted on and electrically coupled to the top layer of the substrate. An electromagnetic interference (EMI) shield encap...