US Patent Issued to Sandisk Technologies on March 4 for "Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings" (California Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,776, issued on March 4, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings" was invented by Roshan Jayakhar Tirukkonda (Milpitas, Calif.), Senaka Kanakamedala (San Jose, Calif.), Raghuveer S. Makala (Campbell, Calif.), Rahul Sharangpani (Fremont, Calif.), Monica Titus (Santa Clara, Calif.) and Adarsh Rajashekhar (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A source-level semiconductor layer and an alternating stack of first material layers and second material layers is formed above a substrate. A hard ma...