US Patent Issued to Sandisk Technologies on July 1 for "Die separation ring for wafers having a large die aspect ratio" (Chinese, American Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,733, issued on July 1, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Die separation ring for wafers having a large die aspect ratio" was invented by Shuo Li (Shanghai), Xiangyang Liu (Shanghai), Xiaodong Liu (Shanghai), Xuri Xin (Shanghai), Weiting Jiang (Shanghai), Zhenghao Wu (Shenzhen, China) and Bo Yang (Dublin, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die separation ring that causes non-uniform expansion of a semiconductor wafer during a semiconductor wafer expansion process. The die separation ring includes an annular body that extends about a central axis. The annular body of the die separation ring includes a f...