US Patent Issued to Sandisk Technologies on July 1 for "Bonded assembly including interconnect-level bonding pads and methods of forming the same" (Belgian, American Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,804, issued on July 1, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Bonded assembly including interconnect-level bonding pads and methods of forming the same" was invented by Lin Hou (Leuven, Belgium), Peter Rabkin (Cupertino, Calif.), Yangyin Chen (Leuven, Belgium), Masaaki Higashitani (Cupertino, Calif.) and Rahul Sharangpani (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a bonded assembly includes providing a first semiconductor die containing and first metallic bonding structures and a first dielectric capping layer containing openings and contacting distal horizontal surfaces of the first me...