US Patent Issued to SANDISK TECHNOLOGIES on Jan. 28 for "Three-dimensional memory device with finned support pillar structures and methods for forming the same" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,213,320, issued on Jan. 28, was assigned to SANDISK TECHNOLOGIES LLC (Addison, Texas).

"Three-dimensional memory device with finned support pillar structures and methods for forming the same" was invented by Seiji Shimabukuro (Yokkaichi, Japan) and Takashi Yamaha (Obu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, memory openings vertically extending through a first region of the alternating stack, memory opening fill structures located in the memory openings, and support pillar structures vertically ex...