ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,828, issued on Jan. 27, was assigned to SANDISK TECHNOLOGIES INC. (Milpitas, Calif.).
"System and method for depositing underfill material" was invented by Choo Par Tan (Penang, Malaysia), Ee May Lim (Penang, Malaysia) and Chee Ern Ng (Penang, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of dispensing an underfill material on a semiconductor device package. A substrate having a semiconductor chip electrically connected thereto and offset from the substrate by solder joints is provided. The semiconductor chip has a footprint defined by a length and width of the semiconductor chip. Standoff heights between the substrate and the sem...