US Patent Issued to Sandisk Technologies on Jan. 20 for "Bonded assembly containing conductive via structures extending through word lines in a staircase region and methods for making the same" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,462, issued on Jan. 20, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Bonded assembly containing conductive via structures extending through word lines in a staircase region and methods for making the same" was invented by Masanori Tsutsumi (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded assembly includes first memory die bonded to a logic die. The first memory die includes a first alternating stack of first insulating layers and first electrically conductive layers, first memory openings vertically extending through the first alternating stack, first memory opening fill structures located within the first ...