US Patent Issued to Sandisk Technologies on Feb. 11 for "Clamped semiconductor wafers and semiconductor devices" (California, Illinois Inventors)

ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,224,259, issued on Feb. 11, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Clamped semiconductor wafers and semiconductor devices" was invented by Kirubakaran Periyannan (Santa Clara, Calif.), Daniel Linnen (Naperville, Ill.) and Jayavel Pachamuthu (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Clamped semiconductor wafers and clamped semiconductor devices include reservoirs filled with a flowable metal which hardens to allow the wafers/devices to be shipped or stored. The hardened metal may also be reflowed to a liquid to allow clamping of the semiconductor wafers together and to allow clamping of the semiconductor pac...