US Patent Issued to Sandisk Technologies on Feb. 10 for "Electrically coupling printed circuit boards using a snap-fit connector" (Malaysian Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,259, issued on Feb. 10, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Electrically coupling printed circuit boards using a snap-fit connector" was invented by Tew Wei Hong (Penang, Malaysia), Beng Gian Ooi (Penang, Malaysia) and Fu Xing Chan (Penang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A snap-fit connector electrically and mechanically couples a first circuit board to a second circuit board. A first portion of the snap-fit connector is positioned on or within the first circuit board. The first portion of the snap-fit connector is electrically coupled to a trace associated with an electronic component on the first...