US Patent Issued to Sandisk Technologies on Feb. 10 for "Bonded assembly containing bonding pads with metal oxide barriers and methods for forming the same" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,787, issued on Feb. 10, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Bonded assembly containing bonding pads with metal oxide barriers and methods for forming the same" was invented by Kensuke Ishikawa (Yokkaichi, Japan), Fumitaka Amano (Yokkaichi, Japan), Shingo Totani (Yokkaichi, Japan) and Linghan Chen (Nagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded assembly includes a first semiconductor die containing first semiconductor devices and a first bonding pad embedded within a first silicon oxide layer, where the first bonding pad includes a first copper containing portion, a second semiconductor die containing...