US Patent Issued to Sandisk Technologies on Dec. 23 for "Semiconductor wafer thinned by horizontal stealth lasing" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,015, issued on Dec. 23, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Semiconductor wafer thinned by horizontal stealth lasing" was invented by Yi Wu (Shanghai), Junrong Yan (Shanghai), Zhonghua Qian (Shanghai), Keming Zhou (Shanghai) and Kailei Zhang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes the step of thinning a semiconductor wafer by a horizontal stealth lasing process, and semiconductor wafers, dies and devices formed thereby. After formation of an integrated circuit layer on a semiconductor wafer, the wafer may be thinned by supporting an active surface of the wafer on a rotating chuck, and foc...