US Patent Issued to Sandisk Technologies on Dec. 23 for "Bifacial semiconductor wafer" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,048, issued on Dec. 23, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Bifacial semiconductor wafer" was invented by Lei Shi (Shanghai), Cong Zhang (Shanghai) and Chin-Tien Chiu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device having one or more bifacial semiconductor wafers. The bifacial semiconductor wafer includes a first array of semiconductor dies on a first planar surface and a second array of semiconductor dies on a second planar surface that is opposite the first planar surface. The first array of semiconductor dies are electrically coupled via a first redistribution layer and the second array o...