US Patent Issued to Sandisk Technologies on Aug. 5 for "Printed circuit board having a temperature profiling connection pad" (Malaysian Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,588, issued on Aug. 5, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Printed circuit board having a temperature profiling connection pad" was invented by Uthayarajan A/L Rasalingam (Penang, Malaysia), Choo Par Tan (Penang, Malaysia) and Mathavan Valu (Pulau Pinang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board (PCB) includes an identified temperature profiling location. The identified temperature profiling location may be a connection pad from a grid of connection pads on the PCB. The connection pad may be located near a center of the grid of connection pads. The connection pad may be coupled to a no...