US Patent Issued to Sandisk Technologies on Aug. 26 for "Three-dimensional memory device containing memory opening monitoring area and methods of making the same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,311, issued on Aug. 26, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Three-dimensional memory device containing memory opening monitoring area and methods of making the same" was invented by Hiroyuki Ogawa (Yokkaichi, Japan), Masato Miyamoto (Yokkaichi, Japan) and Keisuke Shigemura (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a three-dimensional semiconductor device includes forming an alternating stack of insulating layers and spacer material layers over a substrate, forming memory openings formed in the memory array region and monitor openings formed in a monitor region though the alternati...