ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,249, issued on Aug. 26, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).
"Eco-friendly printed circuit board for high temperature and low temperature applications" was invented by Vigneshwarram Kumaresan (Batu Kawan, Malaysia), Vishnu Chandar Janakiraman (Batu Kawan, Malaysia) and Mutharasu Devarajan (Milpitas, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-layer printed circuit board (PCB) is fabricated using basalt fibers instead of glass fibers. Using basalt fibers in lieu of glass fibers makes the PCB more environmentally friendly without sacrificing mechanical and electrical properties. The multi-layer PCB includes a...