US Patent Issued to Sandisk Technologies on Aug. 12 for "Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings" (California Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,976, issued on Aug. 12, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings" was invented by Roshan Jayakhar Tirukkonda (Milpitas, Calif.), Bing Zhou (San Jose, Calif.), Rahul Sharangpani (Fremont, Calif.), Raghuveer S. Makala (Campbell, Calif.), Senaka Kanakamedala (San Jose, Calif.) and Adarsh Rajashekhar (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a structure includes forming an alternating stack of first material layers and second material layers over a substrate, forming a first ...