US Patent Issued to Sandisk Technologies on April 29 for "Wafer surface chemical distribution sensing system and methods for operating the same" (Japanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,837, issued on April 29, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Wafer surface chemical distribution sensing system and methods for operating the same" was invented by Shota Yatsuzuka (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes performing a chemical mechanical polishing (CMP) process on a wafer in a CMP apparatus, loading the wafer into a roll cleaning apparatus after performing the CMP process on the wafer, applying a fluid on a surface of the wafer; brushing the surface of the wafer with a rotating roll brush, and measuring a distribution of the fluid on the surface of the wafer while br...