US Patent Issued to Sandisk Technologies on April 29 for "Semiconductor device manufacturing process including forming a bonded assembly and substrate recycling" (Japanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,719, issued on April 29, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Semiconductor device manufacturing process including forming a bonded assembly and substrate recycling" was invented by Takuya Maehara (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming an etch stop material layer and a planar sacrificial spacer layer over a front surface of a first substrate, forming an insulating encapsulation layer over the planar sacrificial spacer layer and on a backside surface and a side surface of the first substrate, forming a continuous structure including first semiconductor devices over a top sur...