US Patent Issued to Sandisk Technologies on April 22 for "Three-dimensional memory device with separated contact regions" (Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,807, issued on April 22, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Three-dimensional memory device with separated contact regions" was invented by Hiroyuki Ogawa (Nagoya, Japan), Hardwell Chibvongodze (Hiratsuka, Japan), Zhixin Cui (Nagoya, Japan) and Rajdeep Gautam (Nagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory die includes an alternating stack of insulating layers and electrically conductive layers through which memory opening fill structures vertically extend. The memory die includes at least three memory array regions interlaced with at least two contact regions, or at least three contact regions inter...