US Patent Issued to SAMTEC on June 17 for "High aspect ratio vias filled with liquid metal fill" (Indiana, Colorado Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,112, issued on June 17, was assigned to SAMTEC INC. (New Albany, Ind.).

"High aspect ratio vias filled with liquid metal fill" was invented by Christopher David Bohn (New Albany, Ind.), Mark Crain (New Albany, Ind.), Justin Roehm (New Albany, Ind.), Thomas Jacob Hammann (Arvada, Colo.), Nathan Robertson (New Albany, Ind.), Jeremy Brown (New Albany, Ind.), Christopher Pelkey (New Albany, Ind.), Adam Owens (New Albany, Ind.), Russell Payton (New Albany, Ind.) and Russell Frank (New Albany, Ind.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate includes a substrate body made of a material such as glass, and at least one electrical via that ext...