ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,441, issued on April 15, was assigned to SAMTEC INC. (New Albany, Ind.).
"Ultra-dense, low-profile edge card connector" was invented by Marc Epitaux (Gland, Switzerland), Eric J. Zbinden (Santa Clara, Calif.), John Coronati (Colorado Springs, Colo.), Jignesh H. Shah (Santa Clara, Calif.) and Brandon Thomas Gore (Lexington, S.C.).
According to the abstract* released by the U.S. Patent & Trademark Office: "This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance ...