US Patent Issued to Samsung SDI on June 3 for "Curable resin composition, cured film formed therefrom, and electronic device having cured film" (South Korean Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,321,096, issued on June 3, was assigned to Samsung SDI Co. Ltd. (Yongin-si, South Korea).

"Curable resin composition, cured film formed therefrom, and electronic device having cured film" was invented by Seungeun Lee (Suwon-si, South Korea), Dongju Shin (Suwon-si, South Korea), Ji Yoon Kim (Suwon-si, South Korea), Jeehyun Ryu (Suwon-si, South Korea) and Minji So (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A curable resin composition comprising (A) a silicone-based polymer, the surface, and (C) a solvent."

The patent was filed on Aug. 28, 2020, under Application No. 17/597,087.

*For further information, including images, charts...