ALEXANDRIA, Va., July 23 -- United States Patent no. 12,364,459, issued on July 22, was assigned to SAMSUNG MEDISON Co. LTD. (Gangwon-Do, South Korea).
"Ultrasonic probe and manufacturing method therefor" was invented by Jinwoo Jung (Seoul, South Korea), Jisu Kim (Bucheon-si, South Korea), Joonghyun Park (Seoul, South Korea) and Sungjae Jun (Hanam-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An ultrasonic probe according to one embodiment comprises: a plurality of sound absorbing bodies that form a sound absorbing layer; at least one ground connection part that is joined between the sound absorbing bodies; at least one center connection part that is joined between the sound absorbing bodies...