US Patent Issued to SAMSUNG ELECTRONICS on Sept. 9 for "Semiconductor substrate processing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,768, issued on Sept. 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor substrate processing apparatus" was invented by Jinhyuk Choi (Suwon-si, South Korea), Kongwoo Lee (Seoul, South Korea), Beomsoo Hwang (Seoul, South Korea), Myungki Song (Hwaseong-si, South Korea), Duckjin Kim (Seongnam-si, South Korea), Kyusang Lee (Suwon-si, South Korea) and Hyunjoo Jeon (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor substrate processing apparatus includes a substrate transfer module including a chamber having an internal space extending in a first direction within the chamber, a...