US Patent Issued to SAMSUNG ELECTRONICS on Sept. 9 for "Semiconductor packages and methods of forming the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,824, issued on Sept. 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor packages and methods of forming the same" was invented by Yeongbeom Ko (Suwon-si, South Korea), Junyun Kweon (Suwon-si, South Korea), Wooju Kim (Suwon-si, South Korea), Heejae Nam (Suwon-si, South Korea), Haemin Park (Suwon-si, South Korea) and Junggeun Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package, comprising: a first redistribution structure including a first redistribution via; a first package that is on an upper surface of the first redistribution structure and comprises a first pad; a...